IC Insights recently released its Global Wafer Capacity 2019-2023 report that provides in-depth analyses and forecasts of IC industry capacity by wafer size, by process geometry, by region, and by product type through 2023. The newest edition of the Global Wafer Capacity report shows that 300mm wafers took over as the industry’s primary wafer size in terms of total surface area used in 2008. Furthermore, the number of 300mm wafer fabrication facilities in operation continues to increase. With nine new 300mm wafer fabs scheduled to open in 2019, the worldwide number of operational 300mm wafer fabs is expected to climb to 121 this year (Figure 1) and grow to a total of 138 fabs at the end of the forecast period.
