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Toshiba Introduces New Low-Power Flash Technology

BiCS FLASH is a 64-layer, 256Gb 3D flash memory solution that makes larger capacities possible for enterprise applications.

Toshiba America Electronic Components Inc. (TAEC) debuted an all-flash solution for big-data analytics at the Flash Memory Summit (FMS). BiCS FLASH is a 64-layer, 256Gb 3D flash memory solution that makes larger capacities possible for enterprise applications, surpassing the capacity of mainstream two-dimensional NAND flash memory while enhancing reliability and endurance and boosting performance, according to the company.

Toshiba’s 64-layer 3D flash memory builds on the company's reputation in this space; Toshiba was the first to introduce 48-layer 3D flash memory, which it debuted in March 2015. Toshiba also recently celebrated the opening of its new Fab 2 semiconductor fabrication facility, which is dedicated to the production of i3D flash memory solutions.

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